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NXP Semiconductors
LPC1xxx
LPC11C12/C14
L
XTALIN
XTALOUT
=
CL
CP
XTAL
RS
CX1
CX2
002aaf424
Fig 23. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C X1 /C X2 evaluation
Table 15.
Recommended values for C X1 /C X2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency F OSC
1 MHz - 5 MHz
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
Crystal load
capacitance C L
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Maximum crystal
series resistance R S
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
External load
capacitors C X1 , C X2
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
Table 16.
Recommended values for C X1 /C X2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency F OSC
15 MHz - 20 MHz
20 MHz - 25 MHz
Crystal load
capacitance C L
10 pF
20 pF
10 pF
20 pF
Maximum crystal
series resistance R S
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
External load
capacitors C X1 , C X2
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
11.3 XTAL Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C x1 , C x2 , and C x3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
LPC11C12_C14_0
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 00.05 — 23 April 2010
? NXP B.V. 2010. All rights reserved.
41 of 49
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